Test Solutions
JCET provides customers with a full suite of test platforms and engineering services to support a broad range of mixed signal, Radio Frequency (RF), analog, and high-performance digital semiconductor devices. Our full turnkey test services, which include wafer bump, probe, final test, post-test, and system level test, deliver the lowest cost of test for our customers with the highest possible throughput and faster time-to-market.
Our Advantages
From our worldwide factories, JCET provides fully integrated test services and capabilities including:
Front-end test development services and test consultation services
Wafer test, including testing of bumped wafers and known good die (KGD) solutions for assembly of stacked die into a single package
A full suite of optimized post-test services for rapid delivery of the final products to the end customer
Final test of simple and advanced packages using advanced test technology and automatic control of the test process that restricts yield losses to hard failures in the silicon itself
Comprehensive system level test with the highest possible throughput and lowest cost of test
JCET combines operational efficiencies with its proven capabilities and competency to achieve the lowest cost of test (COT) with the highest possible throughput. By engaging JCET early in the product development process, customers benefit from JCET’s experience and guidance for a rapid, predictable, and problem-free production ramp.
Testing services
Wafer Sort
Test Development
RF Test
Mixed-Signal Test
Memory / 3D Test
High-End Digital Test
Strip Test
Final Test
Post Test
ITMS
JCET’s certificated Quality Test Center provides reliability tests, including environmental reliability tests, life reliability tests, and board level reliability tests; and a full range of failure analysis services.
JCET has acquired the CNAS’s Accreditation. CNAS is a labs/testing organization accredited by China National Accreditation Service for Conformity Assessment.
Reliability testing:
Environmental reliability
Environmental reliability ...
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Warpage
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Drop Test(Board Level)
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TCT(Board Level)
Other types of reliability
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Solder
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SHT
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HAST
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Reflow
Failure analysis:
More solutions
