Design Solutions
As the electronics industry moves towards more complex semiconductor packages that are smaller, faster, and higher performance, engineers are faced with the challenge of trying to fit more powerful components into a smaller area without causing long-term reliability issues or stress on a package. Delivering the optimum package design requires an in-depth analysis of key package measurements and simulation.
Key Features
JCET collaborates with customers on die and package designs to provide the best possible products in terms of performance, quality, cycle time and cost. JCET’s full-service package Design Centers help customers determine the optimum package for their specific end product.
Design Services
Customer-centric designers
Integration of customer-supplied designs
Mobile design capability
State-of-the-art design tools
Project data management
Characterization Services
Thermal Analysis TEST
Mold Flow Analysis
Mechanical Analysis
Electrical Analysis
Proven Experience
JCET’s world class design team has extensive experienced in the mobile, networking, computing, consumer, and automotive markets. Their experience covers a wide range of Laminate, leadframe, and wafer-level package designs, including single die, multi-die, Package-on-Package (PoP), Integrated Passive Devices (IPD), and advanced System-in-Package (SiP). JCET’s dedicated design team has the necessary experience to provide complex designs that meet or exceed assembly and cost targets.
Collaborative Design
Today's package designs adhere to stringent thermal and electrical requirements while providing high-end performance for our customer's end products. To ensure a semiconductor package meets performance requirements, JCET’s Design and Characterization Team works closely with the customer through co-design while the integrated circuit (IC) is in development. The “Co-Design” of a package provides the best environment for optimum performance. JCET’s package designs meet our customers’ needs whether as a single chip device or complex System-in-Package (SiP).
Design Process
JCET manages the design process using our Product Data Management system. From the moment a request enters our system the design team works with our characterization experts and our customers to understand their needs for each design. As each new design is received, it undergoes feasibility to determine if the package will meet the requirements of our factories, suppliers, and customers. Our designers collaborate with customers to ensure the optimum package is produced with consideration to cost, assembly and function.
Design Tool Sets
- Cadence SiP / APD
- Autodesk：AutoCad
- DownStream CAM350
- Internally developed support tools
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