Power semiconductors and analog devices are pivotal in energy supply, transmission, and use. Surpassing Moore’s Law limits requires application-driven diversification and integration, with packaging as the enabler.

In power & energy applications, JCET develops AIGC and Communication base station power modules in close partnership with leading customers. We’re expanding capacity for mid-to-high-power devices and modules, extending Kelvin packaging formats (TOLL, TO-263-7, TO-247-4), pioneering bottom, top, and dual-sided cooling structures, and applying silver sintering and DBC processes.

Highlights
Ultra-precision power-module manufacturing and comprehensive AIGC power-system solutions
End-to-end wide bandgap semiconductor solutions and diverse packaging—from wafer processes to products
Si PMIC & power-system solutions providing ~3,000 package types, WLCSP, and SiP customization.
Extensive expertise in wafer processing, advanced architectures, high-temperature materials, and thermal diffusion.