Advancement of Mainstream Package

While building world-class advanced packaging technology and large-scale production, JCET continually refines mainstream packaging—innovative process control and collaborative design boost reliability, cut costs, and expand applications.

Technical Highlights
Advancement of Mainstream Package
Patented HFBP technology for power and signal chain products, with over 10 billion shipments
ECP fan-in and fan-out WLP provides ultra-thin six-sided protection; Full-process capability for power devices with backside metal and frontside copper-nickel-gold RDL
Wide-body SOIC / TSSOP and internal insulation solutions for high-voltage isolation applications
Packaging structures and processes for a full range of sensors including pressure, inertial, magnetic, and optical
Applications
Discrete Devices
High-Power ICs
IPM(Intelligent Power Module)模块
Automotive Electronics
Industrial Electronics
Communication Electronics
More technology