• About Us
    • Company Information
    • Corporate Culture
    • Senior Leadership Team
    • Worldwide Locations
    • News Center
    • ESG
    • Green Manufacturing
    • Conflict-Free Minerals Policy
    • Join JCET
    • Contact Us
  • Technology
    • Wafer Level & Fan Out Packaging
    • System-in-Package
    • Flip Chip Packaging
    • Wirebond Packaging
    • MEMS and Sensors Packaging
  • Services
    • Turnkey Services
    • Design & Characterization
    • Wafer Bumping
    • Packaging Services
    • Test Services
    • Reliability Tests and Failure Analysis
  • Applications
    • Automotive
    • Communications
    • Computing
    • Storage
  • Investor Relations
    • Financial Reports
  • English
    • 中文
    • 한국어
    • 日本語
News Center
About News

News

2025 2024 2023 2022 2021 2020 2019 and before
  • 2010-01-05

    The China’s IC Packaging & Testing Industry Chain Technical Innovation Alliance was established in Beijing

    More
  • 2009-08-10

    Prof. Wang Zhengping, Director of Georgia Institute of Technology and others were invited for lecturing at CET

    More
  • 2009-07-19

    Dr. Li Ming, Rambus — a U.S. leading company in memory technology, came to CET for speech

    More
  • 2009-01-13

    Premier Wen Jiabao inspected CET

    More
  • 2008-09-21

    The 6th China International IC Exhibition & Summit was held in Suzhou

    More
  • 2008-05-17

    JCET made donations to schools

    More
  • 2008-05-07

    JCET won the title “Wuxi Top 10 Technical Innovative Enterprises”

    More
  • 2008-03-09

    JCET Mobile Components (Shenzhen) Promotion 2008 was successfully held

    More
  • << 首页
  • 上一页
  • 6
  • 7
  • 8
  • 9
  • 10
  • 下一页
  • 末页 >>
About Us Investor Relations News Careers Contact Terms
版权所有@江苏长电科技股份有限公司 保留一切权利 苏ICP备05082751号-1 32028102000607

This website uses cookies to improve user experience. By using our website you consent to all cookies in accordance with our Cookie Policy.

Accept