한국어
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2023-02-28
JCET Provides Multiple Customers with Advanced Packaging HVM Solutions for 4D Millimeter-wave Radar
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2023-02-24
STATS ChipPAC’s Automotive Millimeter Wave Radar Packaging Solution Receives Customer Award
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2023-01-05
JCET Chiplet Technologies Achieve High Volume Manufacturing
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2022-12-23
JCET’s Corporate Value Recognized with China Top 100 Enterprise Award
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2022-12-22
JCET Participates in SEMICON JAPAN for the First Time Promoting its Global Business Layout
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2022-11-21
JCET, Fifty years of Unremitting Efforts
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2022-10-28
JCET Hits New Highs for Performance in Q3, High-Performance Packaging Technology Opens New Opportunities for Semiconductor Back-end Manufacturing
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2022-08-25
JCET Performance Hits Another Record High in 1H 2022, Benefiting From Global Resource Optimization
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